Green Electrodeposition 4 - Novel Chemistry

Wednesday, 31 May 2017: 10:30-12:20
Norwich (Hilton New Orleans Riverside)
Sudipta Roy , Giovanni Zangari and Sachio Yoshihara
Welcoming Remarks
Copper Electrodeposition from a Water-Containing Choline Chloride-Based Deep Eutectic Solvent
P. Valverde, T. Green, and S. Roy (University of Strathclyde)
Use of Ultrasound to Modified Electrodeposited Silver and Silver-Tin Microstructures and Composition without Chemical Additives
A. Nevers, L. Hallez, F. Touyeras, and J. Y. Hihn (UTINAM UMR 6213 CNRS University Bourgogne Franche-Comté)
Development of a Functional Reach Compliant Trivalent Chromium Electroplating Process
T. D. Hall, E. J. Taylor, M. Inman, S. Snyder, J. Xu, and R. Radhakrishnan (Faraday Technology, Inc.)
Analysis of Cathodic Reaction Process of SiCl4 in Ionic Liquids
Y. Tsuyuki, T. Fujimura (Dept. of Advanced Science and Engineering, Waseda Univ.), M. Kunimoto, Y. Fukunaka (Res. Org. for Nano & Life Innovation, Waseda University), P. A. Pianetta (SLAC National Accelerator Laboratory), and T. Homma (Dept. of Advanced Science and Engineering, Waseda Univ.)