Green Electrodeposition 4 - Novel Chemistry

Wednesday, 31 May 2017: 10:30-12:20
Norwich (Hilton New Orleans Riverside)
Chairs:
Sudipta Roy , Giovanni Zangari and Sachio Yoshihara
10:30
Welcoming Remarks
10:40
1042
Effect of the Use of Pulse Plating Techniques in Electrodeposited Sn-Cucoatings for Pb-Free, Environmentally-Friendly Applications
L. Wu and A. J. Cobley (Coventry University)
11:00
1043
Copper Electrodeposition from a Water-Containing Choline Chloride-Based Deep Eutectic Solvent
P. Valverde, T. Green, and S. Roy (University of Strathclyde)
11:20
1044
Use of Ultrasound to Modified Electrodeposited Silver and Silver-Tin Microstructures and Composition without Chemical Additives
A. Nevers, L. Hallez, F. Touyeras, and J. Y. Hihn (UTINAM UMR 6213 CNRS University Bourgogne Franche-Comté)
11:40
1045
Development of a Functional Reach Compliant Trivalent Chromium Electroplating Process
T. D. Hall, E. J. Taylor, M. Inman, S. Snyder, J. Xu, and R. Radhakrishnan (Faraday Technology, Inc.)
12:00
1046
Analysis of Cathodic Reaction Process of SiCl4 in Ionic Liquids
Y. Tsuyuki, T. Fujimura (Dept. of Advanced Science and Engineering, Waseda Univ.), M. Kunimoto, Y. Fukunaka (Res. Org. for Nano & Life Innovation, Waseda University), P. A. Pianetta (SLAC National Accelerator Laboratory), and T. Homma (Dept. of Advanced Science and Engineering, Waseda Univ.)
See more of: E01: Green Electrodeposition 4
See more of: Electrochemical/Electroless Deposition
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