One major goal of GaN based technology studies is the fabrication of rugged power switching devices. While this is best achieved through vertical GaN technology, the process development of GaN substrates is not yet mature, and the substrates for lateral power switch are more cost effect than GaN. A common way of doping lateral GaN devices is through ion implantation followed by rapid thermal annealing for ion activation. Activation of most p-type dopants requires temperatures above 1300 °C; however, silicon will activate as an n-type dopant at lower temperatures. This research reports on the electrical properties of devices such as junction field effect transistors and Van der Pauw structures containing silicon doped GaN activated by ion implantation.