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(Invited) 2D Diffusion Barriers for Ultra-Scaled Interconnect Technology

Thursday, 17 May 2018: 11:20
Room 201 (Washington State Convention Center)
C. L. Lo, S. Zhang, and Z. Chen (Purdue University)
In this talk, I will show our characterization of graphene and other 2D materials as ultra-thin Cu diffusion barrier materials and back-end-of-line compatible 2D material synthesis will be presented as well.