As devices continue to shrink, the demands on chemical mechanical polishing (CMP) become more stringent, requiring slurries to be modulated in order to enhance surface quality. Achieving angstrom level uniformity and minimizing defects, results in the need to develop polymeric filtration media that also increases polishing efficiency. Probing the interactions that can occur at the particle/polymer/slurry interface is essential in order to understand the impact of altering the chemistry and the filtration media on the filterability, rate of diffusion, adhesion force, surface roughness, and activation energy (E_A). This work focuses on investigating the interactions between common abrasive particles, such as ceria and silica (in various chemistries), as well as different polymeric filtration media through the use of an electrochemical quartz crystal nanobalance (EQCN) and atomic force microscopy (AFM). The AFM tip is effectively functionalized in solution using epoxy glue to mimic a nanoparticle, which is used to measure the adhesion force between the particle and membrane via force distance curves. These nanoparticles can be reduced, oxidized, or functionalized and can be used to measure the adhesion force at different filtration time intervals, monitoring the change in the particle-polymer interaction. Preliminary results suggest that altering the complexing agent in the slurry can heavily influence the E_A of the interaction between the slurry and filter membrane. Specifically, the activation energy for a copper CMP slurry and an amine-based filter was found to be negative, indicating a barrier-less reaction, due to non-covalent interactions present at the slurry-polymer interface. Changing the complexing agent from glycine to L-alanine and β-alanine revealed the E_A to be positive and negative, respectively, which also changed with the structure of the membrane. Ultimately, both the backbone of the filter and the complexing agent alter the interactions on the surface of the polymer membrane and have shown to have a direct impact on CMP performance.