Y. Fukuzumi, W. Kobayashi, H. Niwa, and Y. Moritomo (University of Tsukuba)

M. C. Tucker (Lawrence Berkeley National Laboratory)

D. Choi, A. J. Crawford, V. Viswanathan, Q. Huang, M. C. Kintner-Meyer, J. G. Zhang, D. Reed, and V. Sprenkle (Pacific Northwest National Laboratory)

S. Joshi, Q. Wang, A. Puntambekar, and V. Chakrapani (Rensselaer Polytechnic Institute)

Y. Moritomo (University of Tsukuba), T. Shibata (National Institute of Technology, Gunma College), Y. Fukuzumi, and W. Kobayashi (University of Tsukuba)

J. Han and Y. Kim (Ulsan National Institute of Science and Technology)

W. Xing (ADA Technologies, Inc.)

K. C. Smith (Mechanical Science and Engineering UIUC, College of Engineering, UIUC) and A. Shrivastava (Materials Science and Engineering, UIUC)

I. Zilberman, F. B. Spingler (Technical University of Munich), A. Rheinfeld (Technical University of Munich (TUM), EES), and A. Jossen (Technical University of Munich)

E. Moazzen, E. V. Timofeeva, and C. U. Segre (Illinois Institute of Technology)

X. Guan (ShanghaiTech University), J. Jiang (Harvard University), and S. Ramanathan (Purdue)