Murata has developed a unique technology in silicon for capacitors and interposers with integrated passive devices .The research was focused on advanced concepts with 3D trenches with extremely high aspect ratio and exquisite high K dielectrics to get to the highest capacitor density with excessive reliability. The technology is compliant with strong capability in terms of packaging enabling outstanding performances of miniaturized products and heterogeneous solutions.

This paper outlines two stacking technologies: one in medical where the performance and form factor parameter are becoming more and more important and the other one is in automotive where higher computing performance will be entailed. Both are subject to demanding requirements in terms of reliability.

The 3D integration schemes, one that doesn’t rely on traditional methods of interconnect and the other with Through Silicon Via (TSV), will be depicted in addition to the manufacturing processes.