G02 - Heterogeneous Integration and Packaging

Wednesday, 1 June 2022: 08:30-11:50
West Meeting Room 115 (Vancouver Convention Center)
Chairs:
Fred Roozeboom and Zia Karim
08:30
Introductory Remarks
08:50
1286
(Invited) Lithium-Based Components Integrated on Silicon: Disruptive, Promising and Credible Solutions for 5G & Beyond
Y. Lamy, F. Dupont, G. Rodriguez, M. Bedjaoui, P. Perreau, M. Bousquet, A. Reinhardt, and S. Oukassi (CEA LETI MINATEC, Univ. Grenoble Alpes)
09:30
1287
Development of Low Temperature Double Level TSV, Hole and Seal Process for Low Pressure Zero Level MEMS Packaging
A. Malainou, D. Sabuncuoglu Tezcan (imec), X. Shujing, and H. Hongtao (Hebei Semiconductor Research Institute)
09:50
1288
Ultra-Flexible Organic Electronics for Biomedical Application
T. Yokota (University of Tokyo) and T. Someya (The University of Tokyo)
10:10
Break
10:30
1289
­­Alternate Approach to Backside Thinning: A Doping Selective Silicon Wet Etch
J. Bahena, J. Fijal, P. Tyler, J. Taddei (Veeco Instruments - Precision Surface Processing), M. Wiemann, and M. Figge (Fraunhofer Institute for Microelectronic Circuits and Systems)
10:50
1290
Combining Advanced Metrology Techniques of 3D-AFM and Tilted-SEM for the Morphological Evaluation of Sidewall Roughness and Angles on Si-Waveguides
R. Coquand (CEA-LETI, Grenoble, France) and T. Dewolf (CEA-Leti Grenoble)
11:10
1291
(Invited, Digital Presentation) Development of 3D-Stacked Artificial Retina Chip with 3DIC/TSV and Advanced Packaging Technology
T. Tanaka (Graduate School of Biomedical Engineering, Tohoku University)
See more of: G02: Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 12
See more of: Electronic Materials and Processing
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