TaN/Hf0.5Zr0.5O2 (HZO)/TaN capacitor was prepared on a Si wafer. TaN electrodes were deposited by DC sputtering method. The thickness of the TaN films was 10 nm. The HZO film was then deposited by the RF magnetron sputtering method using HfO2 and ZrO2 targets. The fabricated capacitor was annealed in a rapid thermal annealing system at 700 °C. The details of the deposition are described in Ref. 4. The direct piezoelectric response of the HZO film was measured using the wafer flexure technique [5]. The strain was applied periodically to the sample, and the charge induced via the direct piezoelectric response was
measured using a lock-in amplifier. While the conventional ferroelectric characterization, including the P-E measurement, might be influenced by the space charge, leakage current so on, the direct piezoelectric response only depends on the remaanenrt polarization because there are no other physical phenomena similar to the direct piezoelectric response. We investigated the state of polarization during the retention and wake-up process. The film showed a time-dependent imprint at room temperature during polarization retention. The internal electric field that generated the imprint gradually increased from 0.05 to 0.6 MV/cm. In contrast, the magnitude of the direct piezoelectric response did not change during the polarization retention. Similar analyses were also carried out for the wake-up process. Based on the obtained results, we concluded that the non-ferroelectric layer exists at the interface between the HZO film and TaN electrode and gradually transitions to ferroelectric phases through the electric field cycle[6]. The presentation will also cover the domain observation of HZO films by the direct piezoeelectric response.
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