There is wide variation in the understanding of the interaction and/or independence of channel mobility and charge trapping in IGZO TFTs. A new interpretation of transport behavior proposes an intrinsic channel mobility with distinctive temperature dependence. Bottom-gate TFTs were fabricated with a 50 nm IGZO film sandwiched between a 50 nm gate oxide and a 50 nm passivation oxide layer. The working metal was molybdenum for the gate electrode and source/drain contacts. A passivation anneal was done and a capping layer was added to promote electrical stability; full process details are provided in a previous report. Devices were tested using a Lakeshore cryogenic probe station, with transfer characteristic measurements taken from room temperature to below 100 K.

Electrical measurements made on long-channel devices (L = 12 µm) has revealed temperature-dependent behavior that is not explained by existing TCAD models employed for defect states and carrier mobility. An IGZO TFT device model has been recently developed using Silvaco Atlas, which accounts for the role of donor-like oxygen vacancy defects, acceptor-like BTS, acceptor-like interface traps, and a temperature-dependent intrinsic channel mobility. The model demonstrates a remarkable match to transfer characteristics measured at T = 150 K to room temperature. The temperature-dependent mobility follows a power-law relationship resembling behavior consistent with ionized defect scattering; the source of which is proposed. Details of the material and device model, and associated defect distribution parameters will be presented.