Pd was deposited on graphene using Cu-mediated SLRR, however, most Cu-mediated SLRR is performed with CuSO4 or Cu(ClO4)2 dissolved in H2SO4 or HClO4. This does not necessarily produce a strong Cu underpotential deposition feature on graphene, so HCl was used as the electrolyte instead. This produced a substantially more pronounced underpotential deposition feature, but cyclic voltammograms in this solution do not appear to agree with typical Cu-S-Cl Pourbaix diagram.
This also resulted in two different types of structures, primarily Cu-containing films and primarily Pd-containing nanoparticles. The films were always found in the presence of the particles, but the particles did not always have accompanying films. A structural analysis of the particles determined that they preferred to interface with graphene along the (110) planes of Pd and have a slight elongation along the [001] direction of about 1.6% when oriented such that their columns were visible in the scanning transmission electron microscope. Based on an analysis of their orientation, this alignment and elongation appear to be the result of Pd minimizing its interfacial strain with graphene. A structural and compositional analysis of the films determined them to be CuCl, and they prefer to interface with graphene along their (111) plane, although the reason for this particular orientation is unclear as there is weaker evidence for a correlation between the alignment of the graphene and the films.