In this paper, material analysis on two CPUs with 10 nm technology node from most advanced mobile phones (iPhone and Samsung) in the market has been delivered. With the help of high spatial resolution transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDS), details of processes can be clearly unveiled and analyzed. For Samsung, Exynos8895 has a higher fin height and broader fin width, tsmc, A11, on the other hand, has shorter fin pitch and thinner interconnection thickness. More detailed differences between these two chips will be presented.