A new world is being formed based on the technologies composed of artificial intelligence, Internet of Things (IoT), and robot systems. Especially, in the research fields of IoT and robot systems, a device with mechanical flexibility can deliver more degrees of freedom on design of the systems. Therefore, the development of soft and flexible electronics becomes an important research direction for wearable and IoT devices. Due to the mechanical flexibility, polymers materials and thin foils made of metals are commonly used in the fabrication of flexible electronic systems. However, the reliability issue under practical operation hinders the applications of these flexible electronics, especially those on polymer substrates. This is attributed to a mismatch of thermal expansion coefficient between substrate and functional materials or low thermal and chemical endurance of polymers and organic materials. A lot of researchers are working hard and together to expand the applicability of current flexible devices. However, new pathway to flexible electronics can also be developed in parallel to provide more subtle solutions, thus needing new platform to integrate functional materials with good thermal and chemical stabilities together with mechanical flexibility. Recently, due to the quick rise of growth facilities, various techniques are employed to acquire flexible oxide heteroepitaxy. In this talk, I will highlight the methods to develop oxide heteroepitaxy with mechanical flexibility, including direct and indirect approaches. I will also provide an overview that classifies the application fields where flexible oxide heteroepitaxy have been adopted and the approach which has been used to develop particular oxide with the emphasis on electronic and photonic devices.