2048
In-Situ Electrical Characterization of Low Temperature Getter Thin Films Activation

Wednesday, 3 October 2018: 16:40
Universal 17 (Expo Center)
S. Lemettre, C. Bessouet, P. Coste (C2N, CNRS / Univ. Paris Sud / Univ. Paris Saclay), H. Lecoq (CNRS-CEMHTI), T. Sauvage (CNRS-CMHTI), A. Bosseboeuf, and J. Moulin (C2N, CNRS / Univ. Paris Sud / Univ. Paris Saclay)
Thanks to their reactivity to gases, getter materials are involved in vacuum packaging to compensate leaks and permeation through the package. After deposition, the material is passivated due to the contact with the air, and must be thermally activated to force the diffusion of the passivation layer inside the film. However, new MEMS technologies imply more fragile devices thus processes with a limited temperature. In this frame, we investigate getter materials presenting a low activation temperature, such as Zr-based alloys.

Moreover, in most investigations of getter films, activation and sorption are characterized separately by room temperature surface analysis techniques in UHV and by sorption experiments under specific gases, respectively. In this work, we have studied the behavior of getter thin films in vacuum as a function of the temperature and the pressure to be as close as possible to the conditions of integration, i.e. wafer bonding. This consisted in following the sheet resistance measured by using the 4-probes technique and comparing electro-thermal properties (resistivity, Temperature Coefficient of Resistance TCR) to pre- and post- characterization (composition, structure).

Thin films of Zr, V, Ti, Zr-Ti, Zr-V and Zr-Co with thicknesses of 300-400 nm have been deposited by co-evaporation in UHV. Their sheet resistance was measured as a function of the temperature under vacuum. The control of the pressure, from 10-6 to 10-3 mbar, allowed to activate the films in different conditions. For as-deposited films, results show that the resistivity and TCR are linked and follow the Mooij rule: the TCR decreases with the resistivity and becomes negative for resistivities higher than 150 µW.cm. The values globally depend on the composition, but separated groups are also linked to the disorder of the structure, from the lowest to the highest: pure metals, Zr-Ti, Zr-V then Zr-Co. In case of Zr-Ti, the grain size directly impacts the evolution of the coupled TCR and resistivity.

The activation in vacuum involves simultaneous and continuous diffusion inside the films and sorption at the surface. The latter cannot be avoided, even at 10-6 mbar, and the resistivity increases with the square root of the time. However, differences of behavior as a function of the pressure can be linked to the gettering efficiency and the diffusion length of oxygen in the material, which depends on both the composition and the microstructure. Crystalline Zr-Ti films behave as Zr and Ti and the grain size directly impacts the diffusion, thus the quantity of oxygen sorbed in the film. The structure of Zr-V or Zr-Co is more complex, which can be either crystalline or amorphous depending on the composition. Large variations in the sheet resistance can be obtained and the high disorder of the structure allow them to sorb more gaseous species than Zr-Ti.