Electrochemical Processes for Additive Manufacturing

Thursday, 4 October 2018: 08:00-13:00
Universal 10 (Expo Center)
Chairs:
Qiang Huang , Maria Inman and Trevor M Braun
08:00
846
(Invited) Patterned Printing of Ceramics By Electrodeposition, and Applications in Micro-Robotics
A. H. W. Ngan, P. Wang, and K. K. W. Kwan (University of Hong Kong)
08:40
847
3D Printing of Nanotwinned Metals
M. Minary (University of Texas at Dallas)
09:00
848
“Wireless” Direct-Write Electrodeposition and Patterning Via Bipolar Electrochemistry
T. M. Braun (NIST) and D. T. Schwartz (University of Washington)
09:20
849
Electrochemical 3D Printing with Nanopipettes
D. Momotenko, T. Zambelli, and J. Vörös (ETH Zurich)
09:40
850
Electrodeposition of Free Standing Copper Structures with Organic Additives
Q. Huang, R. Gyorgak, R. Pak, and J. Collins (The University of Alabama)
10:00
break
10:20
851
(Invited) Electrochemical Micromachining Based on Confined Etching
D. P. Zhan, L. Han (Department of Chemistry, Xiamen University), Z. Q. Tian (Xiamen University), and Z. W. Tian (Department of Chemistry, Xiamen University)
11:00
852
Electrochemical Manufacturing to Support Industry 4.0 – Spark Assisted Chemical Engraving (SACE)
L. A. Hof and R. Wüthrich (Concordia University)
11:20
853
Hierarchically Porous Structures Prepared By Electrodeposition Onto 3D-Printed Substrates
D. B. Robinson, M. Salloum, C. G. Jones, B. J. Kaehr, M. A. Gallegos, G. M. Buffleben, B. E. Mills, A. W. Higginbotham, G. F. Garcia, V. Lebegue, R. K. Atwal, and R. K. Nishimoto (Sandia National Laboratories)
11:40
854
Coupling Additive Manufacturing and Wet Metallization for Advanced Microfabrication
R. Bernasconi and L. Magagnin (Politecnico di Milano)
12:00
855
An Investigation of the Electropolishing of Metal Parts Fabricated By Powder Bed Fusion Additive Manufacturing
C. O'Neil, Y. Wu, A. Lassell, S. Dobson, and L. Yang (University of Louisville)
12:20
856
Electrochemical Surface Finishing of Additively Manufactured Parts
T. D. Hall, H. Garich, S. Snyder, and E. J. Taylor (Faraday Technology, Inc.)
12:40
857
Additively Manufactured Electrochemical Plating Enclosures
A. J. Thorpe, C. L. Arrington, and J. R. Pillars (Sandia National Laboratories)
See more of: E05: Electrodeposition for Additive Manufacturing
See more of: Electrochemical/Electroless Deposition
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