2073
Thermomechanical Properties of Electroplated Cu and Its Effect On Beol Leakage for Logic Devices

Tuesday, October 29, 2013: 11:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Hojin Lee , SAMSUNG ELECTRONICS Co., Ltd., Hwasung, South Korea
Jinho An, Ph.D , SAMSUNG ELECTRONICS Co., Ltd.
Dosun Lee, Ph.D , SAMSUNG ELECTRONICS Co., Ltd.
Kwangjin Moon , SAMSUNG ELECTRONICS Co., Ltd.
Soyoung Lee , SAMSUNG ELECTRONICS Co., Ltd.
Byung Lyul Park , SAMSUNG ELECTRONICS Co., Ltd.
Siyoung Choi, Ph.D , SAMSUNG ELECTRONICS Co., Ltd.
Ho-Kyu Kang, Ph.D , SAMSUNG ELECTRONICS Co., Ltd.
ES Chung, Ph.D , SAMSUNG ELECTRONICS Co., Ltd.
Ilsub Chung, Ph.D , Sungkyunkwan University

Abstract:

See more of: Three Dimensional Interconnections 2
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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