E7 Processing, Materials, and Integration of Damascene and 3D Interconnects 5
Lead Organizer: K. Kondo (Osaka Prefecture University)
Co-organizers: Rohan N. Akolkar (Intel Corporation) , D. P. Barkey (University of New Hampshire) , Wei-Ping Dow (National Chung Hsing University) , Masanori Hayase (Tokyo University of Science) , Mitsumasa Koyanagi, PhD (Tohoku University) , S. Mathad (S/C Technology Consulting) , Peter Ramm (Fraunhofer Research Institution EMFT Munich) , F. Roozeboom (Eindhoven University of Technology) and Shoso Shingubara (Kansai University)