E7 Processing, Materials, and Integration of Damascene and 3D Interconnects 5

Lead Organizer: K. Kondo (Osaka Prefecture University)

Co-organizers: Rohan N. Akolkar (Intel Corporation) , D. P. Barkey (University of New Hampshire) , Wei-Ping Dow (National Chung Hsing University) , Masanori Hayase (Tokyo University of Science) , Mitsumasa Koyanagi, PhD (Tohoku University) , S. Mathad (S/C Technology Consulting) , Peter Ramm (Fraunhofer Research Institution EMFT Munich) , F. Roozeboom (Eindhoven University of Technology) and Shoso Shingubara (Kansai University)

Monday, October 28, 2013

08:00-11:50


Invited Talks 1
Union Square 21, Tower 3, 4th Floor
Chair(s): Kazuo Kondo, Ph.D. and Rohan Akolkar

14:00-15:20


Invited Talks 2
Union Square 21, Tower 3, 4th Floor
Chair(s): S. Mathad and Mitsumasa Koyanagi, PhD

15:20-16:40


Three Dimensional Interconnections 1
Union Square 21, Tower 3, 4th Floor
Chair(s): Mitsumasa Koyanagi, PhD and Shoso Shingubara

Tuesday, October 29, 2013

08:00-12:00


Three Dimensional Interconnections 2
Union Square 21, Tower 3, 4th Floor
Chair(s): Masanori Hayase, Doctor of Engineering and Rohan Akolkar

14:00-14:20


Three Dimensional Interconnections 3
Union Square 21, Tower 3, 4th Floor

14:20-18:00


Copper Damascene Interconnections
Union Square 21, Tower 3, 4th Floor
Chair(s): S. Mathad and Shoso Shingubara

Wednesday, October 30, 2013

08:40-12:00


Copper Electrodeposition Fundamentals
Union Square 21, Tower 3, 4th Floor
Chair(s): Masanori Hayase, Doctor of Engineering and Wei-Ping Dow