Invited Talks 2

Monday, October 28, 2013: 14:00-15:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Chairs:
S. Mathad and Mitsumasa Koyanagi, PhD
14:00
2057
Challenges for Scaled Damascene Interconnects
Silvia Armini, Ph.D., imec; Johan Swerts, imec; Nicolas Jourdan, imec; Yong Kong Siew, imec; Juergen Boemmels, imec; Zsolt Tokei, PhD, imec; Herbert Struyf, Ph.D., imec
14:40
2058
Nanoscale Wiring By Cu Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte
Masato Sone, Dr., Precision and Intelligence Laboratory, Tokyo Institute of Technology
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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