Three Dimensional Interconnections 3

Tuesday, October 29, 2013: 14:00-14:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
14:00
2074
Low Temperature Fusion Wafer Bonding for Wafer-Level 3D Integration Applications
Juergen Burggraf, EV Group; Julian Bravin, EV Group; Harald Wiesbauer, EV Group; Viorel Dragoi, EV Group
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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