2074
Low Temperature Fusion Wafer Bonding for Wafer-Level 3D Integration Applications

Tuesday, October 29, 2013: 14:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Juergen Burggraf , EV Group, Sankt Florian/Inn, Austria
Julian Bravin , EV Group
Harald Wiesbauer , EV Group
Viorel Dragoi , EV Group, Sankt Florian/Inn, Austria

Abstract:

See more of: Three Dimensional Interconnections 3
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See more of: Dielectric and Semiconductor Materials, Devices, and Processing