2056
Fabrication and Characterization of Grain Growth in Electroplated Cu for 3D IC Interconnect Applications

Monday, October 28, 2013: 11:10
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Tao-Chi Liu, Ph.D. , Global semiconductor applications center, Enthone INC., Taoyuan, Taiwan
Shing-Ru Wang , Global semiconductor applications center, Enthone INC.
Michael Corey , Global semiconductor applications center, Enthone INC.

Abstract:

  • E7-2056 (2033.6KB) - Abstract Text
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