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Monitoring of  Polymer Removal Process  for Copper Interconnect

Tuesday, October 29, 2013: 11:40
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Eugene Shalyt, Ph.D. , ECI Technology, Totowa, NJ
Guang Liang, B.Sc. , ECI Technology
Jingjing Wang, Ph.D. , ECI Technology
Michael Pavlov, M.Sc. , ECI Technology
Vladimir Dozortsev, Ph.D. , ECI Technology
Chuannan Bai, Ph.D. , ECI Technology
Peter Bratin, Ph.D. , ECI Technology

Abstract:

See more of: FEOL & BEOL Cleaning
See more of: E8: Semiconductor Cleaning Science and Technology 13 (SCST 13)
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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