Tuesday, October 29, 2013: 08:50-12:00
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Chairs:
Paul W. Mertens
and
Akshey Sehgal
10:00
Evaluation of TaN as the Wet Etch Stop Layer during the 22nm HKMG Gate Last CMOS Integrations
Hushan Cui, Chinese Academy of Sciences;
Jing Xu, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Jianfeng Gao, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Jinjuan Xiang, Chinese Academy of Sciences;
Yihong Lu, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Zhaoyun Tang, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Xiaobin He, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Tingting Li, Chinese Academy of Sciences;
Jun Luo, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Xiaolei Wang, Chinese Academy of Sciences;
Bo Tang, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Jiahan Yu, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Tao Yang, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Jiang Yan, Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences;
Junfeng Li, Chinese Academy of Sciences;
Chao Zhao, Chinese Academy of Sciences
11:00
Effective Defect Control in TiN Metal Hard Mask Cu/Low-k Dual Damascene Process
Alexander Kabansky, PhD, Lam Research Corporation;
Samantha S.H. Tan, PhD, Lam Research Corporation;
Eric A. Hudson, PhD, Lam Research Corporation;
Gerardo Delgadino, PhD, Lam Research Corporation;
Lajos Gancs, PhD, Lam Research Corporation;
Jeffrey Marks, PhD, Lam Research Corporation
11:40
Monitoring of Polymer Removal Process for Copper Interconnect
Eugene Shalyt, Ph.D., ECI Technology;
Guang Liang, B.Sc., ECI Technology;
Jingjing Wang, Ph.D., ECI Technology;
Michael Pavlov, M.Sc., ECI Technology;
Vladimir Dozortsev, Ph.D., ECI Technology;
Chuannan Bai, Ph.D., ECI Technology;
Peter Bratin, Ph.D., ECI Technology
