2084
Effect of Dynamic Electric Field On Dielectric Breakdown in Damascene Cu Interconnects

Tuesday, October 29, 2013: 17:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Jun-Young Song, B.S. , Seoul National University, Seoul, South Korea
Han-Wool Yeon, MS , Seoul National University
Jang-Yong Bae , Samsung electronics
Yu-Chul Hwang, Ph. D. , Samsung electronics
Young-Chang Joo, Ph. D. , Seoul National University, Seoul, South Korea

Abstract:

See more of: Copper Damascene Interconnections
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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