1547
Ti/Al/Ni/Cu Ohmic Contact with Low Contact Resistance and Smooth Surface Morphology for AlGaN/GaN HEMT
The X-ray diffraction (XRD) and transmission electron microscopy (TEM) results suggest that the formation of TiN at the Ti/semiconductor interface has played an important role in achieving low contact resistance similar to the case for the Ti/Al/Ni/Au structure. In addition, the formation of more stable Ti-Al-Cu based alloys in the Cu-based ohmic contact had successfully confined the Cu within the ohmic contact. Both TEM and Auger electron spectroscopy (AES) results confirmed that no Cu was detected in the semiconductor layers. Finally, high electron mobility transistors (HEMTs) were fabricated using the Cu- and Au-based ohmic contacts. Both devices showed the similar DC characteristics suggesting that the Ti/Al/Ni/Au metallization has a great potential to be used as the ohmic contact for AlGaN/GaN devices.