1409
(Invited) 3D Packaging Technologies and Applications, Latest Challenges and Supply Chain Activities
Semiconductor industry, for more than four decades, has rigorously followed Moore's Law in scaling down the CMOS technologies. Although several new materials and processes are being developed to address the challenges of future technology nodes, in the coming years they will be limited with respect to functionalities that future devices will require. As a consequence a clear trend of moving from CMOS to package and system architecture can be observed. Three-dimensional (3D) technology using the well-known Through Silicon Via (TSV) interconnect is one the emerging options, considered today the most advanced technology, that could enable various heterogeneous integration. 3D Integration is not limited to the CMOS scaling in itself, it is rather based on bringing more functionalities by stacking different type of devices (Logic, Memory, Analog, MEMS, Passive components) while reducing the form factor of the packaging. This functional diversification is also known as More-than-Moore. In addition, considering Known Good Die approach, each component of the 3D package could have a different manufacturer using different wafer sizes and node technology, thus bringing more complexity but also more opportunities and responsibilities to the supply chain. There are several business models identified, either using vertical integration or collaborative approach, if a dominant one will emerge or several tactics will co-exist, it is still remains a key question that will have to be answered. The supply chain interaction and key players will be addressed in this presentation, including current and future standardization needs. This is today a key for the manufacturing of advanced 3D devices. 3D integration is considered today a new paradigm for the semiconductor industry, since it will drive evolution for packages for the coming decades. Due to several advantages that TSV technology can bring, several platforms have started. 3D WLCSP, 2.5D interposers & 3DIC are the main platforms that will be studied in this paper. Market forecasts in terms of wafer starts, market revenue, segments and end-products as well as supply chain activities and major player interactions will be presented. The industry has enthusiastically been waiting for mass production of 3D ICs. Although some small level of production has already been reported, the adoption rate in high volume manufacturing (HVM) is still low due to unresolved challenges that the industry still needs to address. Process technology is not fully mature, there are still many challenges in bonding and de-bonding, testing as well as thermal management that have to be overcome. Furthermore, design tools have to be fully released to enable proper 3D integration design. Looking at the time to market it is foreseen that device such as the Hybrid Memory Cube, combining high-speed logic with multiple stacks of TSV bonded memories, will come into high volume production in 2014. This will definitely change the world of the memory market and will significantly speed up the adoption of 3D technologies. Technology roadmaps for 3D integration will also be included in the manuscript and reviewed during the presentation.
References:
3DIC & TSV Interconnects - 2012 Business Report L.Cadix; A.Pizzagalli; E. Mounier; P. Garrou, YM. Yannou; J. Baron - Yole Developpement
2.5D, 3DIC & TSV Interconnects IP Report L. Cadix - Yole Developpement
Equipment & Materials for 3DIC and Wafer-Level-Packaging - L.Cadix; A.Pizzagalli; E. Mounier; P. Garrou, J. Baron - Yole Developpement