More-Than-Moore Technology

Tuesday, May 13, 2014: 08:00-10:30
Union, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Yiyu Shi and F Levent Degertekin
08:00
1407
Integrated CMOS-MEMS Technology and Its Applications
K. Machida (NTT Advanced Technology Corporation, Tokyo Institute of Technology), T. Konishi (NTT Advanced Technology Corporation), D. Yamane (Tokyo Institute of Technology), H. Toshiyoshi (The University of Tokyo), and K. Masu (Tokyo Institute of Technology)
08:40
1408
(Invited) Knitted Electrochemical Capacitors Via Natural Fiber Welded Electrode Yarns
D. P. Durkin (U. S. Naval Academy), K. Jost (Drexel University), E. K. Brown (U. S. Naval Academy), L. M. Haverhals (Bradley University), G. Dion (Drexel University), Y. Gogotsi (Dept of Mat. Sci. and Eng., Drexel University), H. C. De Long (Air Force Office of Scientific Research), and P. C. Trulove (U. S. Naval Academy)
09:20
Break
09:50
1409
(Invited) 3D Packaging Technologies and Applications, Latest Challenges and Supply Chain Activities
R. Beica, T. Buisson, and A. Pizzagalli (Yole Developpement)
See more of: N3: More-Than-Moore
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