Electroless Deposition: Principles and Applications 3 - Part I

Monday, May 12, 2014: 08:00-12:00
Orange, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Stojan S. Djokic and John Lewellen Stickney
08:00
Welcoming Remarks
08:05
516
Electroless Deposition: History, Status and Future Directions
S. S. Djokic (Elchem Consulting Ltd.)
08:45
517
DFT Computational and Experimental Study of Electroless Nickel Deposition
L. Magagnin, C. Cavallotti, and P. L. Cavallotti (Politecnico di Milano)
09:05
518
Electroless Atomic Layer Deposition
J. L. Stickney, D. M. Benson, K. Jagannathan (The University of Georgia), and D. B. Robinson (Sandia National Laboratories)
09:25
519
Direct Electroless Plating of Iron-Boron on Copper
J. Blickensderfer, P. Altemare (Case Western Reserve University), K. O. Thiel, H. J. Schreier (Atotech, Deutschland GmbH), and R. Akolkar (Case Western Reserve University)
09:45
Intermission
10:00
520
Surface Treatment of Plastics with Ionic Liquids for Decorative Metal Deposition
A. Kirste, S. Lutter, S. Son, T. Urban, F. Nicolini, and A. Fischer (BASF SE)
10:20
521
Peculiarities of Electroless Copper Deposition Using Environmentally-Friendly Natural Polyhydroxylic Compounds As Cu(II) Ligands
E. Norkus, K. Prusinskas, I. Stalnioniene, and L. Tamasauskaite-Tamasiunaite (Center for Physical Sciences and Technology)
10:40
522
Electroless Displacement Deposition of Noble Metal on Silicon Powder for Recovering from Urban Mines
K. Fukuda, N. Fukumuro (University of Hyogo), S. Sakamoto (Nippon Oikos Co., Ltd., University of Hyogo), and S. Yae (University of Hyogo)
11:00
523
Electroless Deposition By Surface Limited Redox Replacement in One Cell Configuration
S. J. Ambrozik (Department of Chemistry, SUNY at Binghamton), N. Vasiljevic (School of Physics, University of Bristol), and N. Dimitrov (Department of Chemistry, SUNY at Binghamton)
11:20
524
Adhesion and Interfacial Structure of Metal Film Electrolessly Deposited on Si Using Au Nanoparticles as Catalysts
H. Atsushiba (University of Hyogo), Y. Orita (Murata Co., Ltd.), S. Sakamoto (University of Hyogo, Nippon Oikos Co., Ltd.), N. Fukumuro, and S. Yae (University of Hyogo)
11:40
525
Synthesis of Co-Deposited Electroless Pd-Cu Catalyst for Nitrate Reduction
S. Anderson (Florida A&M University), E. E. Kalu (Florida A&M University - Florida State University College of Engineering), and E. N. Onyeozili (Department of Chemistry, Florida A&M University)
See more of: D2: Electroless Plating: Principles and Applications 3
See more of: Electrochemical/Electroless Deposition
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