More-Than-Moore Applications

Monday, May 12, 2014: 10:20-11:40
Union, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Yaw S. Obeng and Andrew Hoff
10:20
1401
(Invited) Monolithic Three-Dimensional Integrated Circuits: Process and Design Implications
H. Geng, L. Maresca (Missouri University of Science and Technology), B. Cronquist, Z. Or-Bach (MonolithIC 3D Inc.), and Y. Shi (Missouri University of Science and Technology)
 
1402
Heterogeneous Integration of Plasmonics with Si-Photonics & Microelectronics for High-Performance Optical Routing (Cancelled)
See more of: N3: More-Than-Moore
See more of: Dielectric Science and Materials
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