Advances in Wafer Bonding for 3D Integration and Other Applications

Tuesday, 7 October 2014: 12:20
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
J. J. Q. Lu (Rensselaer Polytechnic Institute)
Bonding is one of the key technologies that enable the 3D integration.  3D integration has more choices in terms of 3D process flows, such as chip-on-chip (CoC), chip-on-wafer (CoW) or wafer-on-wafer (WoW).  Bonding process can be used to glue multiple functional IC chips vertically and provide some combinations of mechanical, thermal, electrical and optical connections between chips or wafers permanently, or to provide temporary mechanical support for wafer thinning and thinned wafer handling.  Bonding process also varies with different materials and applications.  The choice of bonding technology depends on combinations of the chips and their required process conditions such as temperature limitations. This invited talk focuses on advances in bonding technologies for 3D integration and other applications, including different bonding approaches, requirements for materials and processes, bonding quality characterizations and application-specific bonding technologies.