TSV Filling - Optimal Filling and Evaluation

Monday, October 12, 2015: 14:00-16:00
Borein A (Hyatt Regency)
Chairs:
Harold Philipsen and Kazuo Kondo
14:00
867
Optimizing TSV Fill Phases for Improved Fill Rate, Process Stability and Void Performance
J. Ghekiere, R. Mikkola, D. Kebreab, J. Burnham, B. Hoerner (Applied Materials), and D. Erickson (Applied Materials)
 
868
Impact of Accelerator Decomposition Products to the Stability of TSV Filling Processes (Cancelled)
 
869
Extreme Bottom-up in Through Silicon Vias by Leveler Pre-adsorption (Cancelled)
15:20
870
Reduction of Thermal Expansion Coefficient of Electrodeposited Copper
K. Kondo (Osaka Prefecture University), S. Mukahara, J. Onuki (Ibaraki University), and M. Yokoi (Osaka Prefecture University)
 
871
Scanning Acoustic Microscopy Beyond Conventional Applications (Cancelled)
See more of: D05: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
See more of: Dielectric Science and Materials
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