D05 Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
D05 Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
Sponsor(s):
Electronics and Photonics,
Dielectric Science and Technology
Lead Organizer: Kazuo Kondo (Osaka Prefecture University)
Co-organizers: S. Mathad (Semiconductor Tech. Consulting) , Rohan Akolkar (Case Western Reserve University) , Wei-Ping Dow (National Chung Hsing University) , Harold Philipsen (IMEC) , Masanori Hayase (Tokyo University of Science) , Mitsumasa Koyanagi (Tohoku University) , Yutaka Kaneko (Kyoto University) and F. Roozeboom (Eindhoven University of Technology)