Cu Electrodeposition - from Fundamentals to Applications II

Tuesday, October 13, 2015: 10:40-12:00
Borein A (Hyatt Regency)
Chairs:
Wei-Ping Dow and S. Mathad
10:40
875
(invited) Copper Electroplating Technology for Packaging
C. H. Lai (BASF Taiwan Ltd.), Y. C. Yuan (BASF Taiwan Ltd.), M. Arnold (BASF SE), and D. Mayer (BASF SE)
11:20
876
Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits
Y. S. Obeng, C. A. Okoro, J. J. Ahn, L. You (National Institute of Standards and Technology), and J. J. Kopanski (National Institute of Standards and Technology)
11:40
877
Combined Surface-Activated Bonding Technique for Low-Temperature Cu/SiO2 Hybrid Bonding
R. He (The University of Tokyo), M. Fujino, A. Yamauchi (Bondtech Co., Ltd.), and T. Suga (The University of Tokyo)
See more of: D05: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
See more of: Dielectric Science and Materials
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