Via and Trench Filling - Damascene Process and PCB

Monday, October 12, 2015: 10:40-12:00

Borein A (Hyatt Regency)

Chairs:

Kazuo Kondo and Masanori Hayase

10:40

863

V. H. Hoang (Osaka Prefecture University) and K. Kondo (Osaka Prefecture University)

11:00

864

C. C. Liu (National Chung Hsing University) and W. P. Dow (National Chung Hsing University)

11:20

865

S. I. Wen (National Chung Hsing University) and W. P. Dow (National Chung Hsing University)

11:40

866

T. Kitahara (Kyoto University) and Y. Kaneko (Kyoto University)