Cu Electrodeposition - from Fundamentals to Applications I

Tuesday, October 13, 2015: 09:00-10:20
Borein A (Hyatt Regency)
Chairs:
Masanori Hayase and Harold Philipsen
09:00
872
Towards Quantification of Contaminants in Electrodeposited Cu Films
N. T. M. Hai, V. Grimaudo, P. Moreno-García (University of Bern), and P. Broekmann (University of Bern)
09:40
873
The Studies of Spontaneous Potential Oscillation in a Galvanostatic Copper Electrodeposition and the Crystallographic Textures Thereof
P. F. Chan (National Chung Hsing University) and W. P. Dow (National Chung Hsing University)
10:00
874
Superconformal Filling of High Aspect Ratio through Glass Vias for Interposer Applications Using Tnbt and Ntbc Additives
N. Dimitrov (Department of Chemistry, SUNY at Binghamton), P. Ogutu (Department of Chemistry SUNY - Binghamton), and E. Fey (Department of Chemistry, SUNY - Binghamton,)
See more of: D05: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
See more of: Dielectric Science and Materials
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