Wafer Drying-Related Issues

Tuesday, October 13, 2015: 09:00-11:00
104-A (Phoenix Convention Center)
Chairs:
Steven Verhaverbeke and Paul W Mertens
09:00
1023
(Invited) Supercritical Drying: A Sustainable Solution to Pattern Collapse of High-Aspect-Ratio and Low-Mechanical-Strength Device Structures
H. W. Chen, S. Verhaverbeke, R. Gouk, K. Leschkies, S. Sun, N. Bekiaris (Applied Materials, Inc.), and R. J. Visser (Applied Materials, Inc.)
09:30
1024
Effect of Surface Energy Reduction for Nano-Structure Stiction
T. Koide, S. Kimura, H. Iimori, T. Sugita, K. Sato, Y. Sato (Toshiba), and Y. Ogawa (Toshiba)
09:50
Cofee Break
10:10
1025
Dewetting Model Study on a Spinning Substrate - Challenges for Low Chemical Consumption
K. I. Sano (Lam Research Corp.), D. Mui (Lam Research), and M. Kawaguchi (Lam Research)
 
1026
Effect of Surface Reactivity on Watermark Formation Studied By Sessile Droplet Evaporation Approach (Cancelled)
10:50
Break
See more of: G02: Semiconductor Cleaning Science and Technology 14 (SCST 14)
See more of: Electronic Materials and Processing
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