Novel Design and Electrodeposition Modalities I

Tuesday, October 13, 2015: 09:00-11:40
Russell B (Hyatt Regency)
Chairs:
Elizabeth J Podlaha , Qiang Huang and Zhanhu Guo
09:00
903
(Invited) Development of Bimetallic Electrocatalysts and Electrodes for Carbon Dioxide Electrolysis Via Direct Deposition Strategies
K. Carroll, Y. W. Hsiao, S. M. Brown, L. Su (Massachusetts Institute of Technology), and F. R. Brushett (Massachusetts Institute of Technology)
09:40
905
(Invited) Advanced Materials for Integrated on-Chip Power Converter
H. Deligianni, N. Wang (IBM, T.J. Watson Research Center), O. Jinka, J. Yoon (IBM, Thomas J. Watson Research Center), E. J. O'Sullivan, L. Romankiw (IBM TJ Watson Research Center), and W. J. Gallagher (IBM, Thomas J. Watson Research Center)
10:00
Coffee break
10:20
906
(Invited) Controlling Component Distribution in Electrodeposited Multilayer and Alloy Films
I. Bakonyi (Wigner Research Centre for Physics, Hung. Acad. Sci.) and L. Péter (Wigner Research Centre for Physics, Hung. Acad. Sci.)
10:40
907
Modification of Electrodeposited Co-Pd Alloy Catalysts By Superimposed High Magnetic Field
P. Zabinski, K. Mech, S. Banbur-Pawlowska (AGH University of Science and Technology), and R. Kowalik (AGH University of Science and Technology)
11:00
908
Direct and Pulse Plating of Metastable Zn-Ni Alloys
S. Ieffa, R. Bernasconi, L. Nobili, P. L. Cavallotti (Politecnico di Milano), and L. Magagnin (Politecnico di Milano)
11:20
909
Mediated Electrochemical Deposition of Copper and Silver Thin Films for Improved Resistivity, Grain Size and Intrinsic Stress
T. D. Pounds (Johns Hopkins University), S. L. Farias, K. Sieradzki (Arizona State University), and R. C. Cammarata (Johns Hopkins University)