Device Application, Manufacturing

Monday, October 12, 2015: 09:00-10:20
Borein A (Hyatt Regency)
Chair:
Fred Roozeboom
09:00
861
Plasma Dicing: Current State & Future Trends
R. Westerman, G. Grivna (ON Semiconductor), K. Mackenzie (Plasma-Therm, LLC), T. Lazerand (Plasma-Therm, LLC), and J. Doub (ON Semiconductor)
09:40
862
Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices
J. C. Souriau, J. M. Herrera Morales, L. Castagné (CEA, LETI, MINATEC Campus, Univ. Grenoble Alpes), G. Simon (CEA, LETI, MINATEC Campus, Univ. Grenoble Alpes), K. Amara (Sorin CRM SAS), and B. Boutaud (Sorin CRM SAS)
See more of: D05: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
See more of: Dielectric Science and Materials
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