TSV Fabrication - Etching, Dielectric

Tuesday, October 13, 2015: 14:00-15:00
Borein A (Hyatt Regency)
Chairs:
Fred Roozeboom and Yutaka Kaneko
14:00
878
Novel Si Etching and Dielectric Liner Film Processing Technologies for Low-Cost TSV Packaging
Y. Morikawa (ULVAC,Inc.)
14:40
879
Electrografted P4VP as Dielectric in High Aspect Ratio TSV: Surface Preparation and Thermomechanical Consideration  
T. Dequivre (Université de Sherbrooke), E. Al Alam (Université de Sherbrooke), J. Plathier (Institut National de la Recherche Scientifique), A. Ruediger (Institut National de la Recherche Scientifique), G. Brisard (Université de Sherbrooke), and S. Charlebois (Université de Sherbrooke)
See more of: D05: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
See more of: Dielectric Science and Materials
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