Emerging CMP Technologies

Thursday, 2 June 2016: 13:30-16:20
Sapphire 411 B (Hilton San Diego Bayfront)
Chair:
Yaw S. Obeng
13:30
1053
(Invited) Critical Review of CMP Requirements in the Future
G. Banerjee (Air Products and Chemicals Inc)
14:10
1054
Surface Characterization Driven CMP Optimization for Gallium Nitride
A. Karagoz (Ozyegin University), M. Siebert, P. Leunissen (BASF SE), and G. B. Basim (Ozyegin University)
14:30
Afternoon break
14:50
1055
Nano-Sized Chemical Release Capsules Enable High Planarization Efficiency CMP Processes
R. Ihnfeldt, K. Javery, K. Nguyen, and M. Nguyen (General Engineering & Research, L.L.C.)
15:10
1056
Study on the Polishing Performance of Silicon Carbonitride (SiCN)
L. Qin, S. Gu, H. J. Kim, J. H. Han (GLOBALFOUNDRIES Inc.), and D. R. Koli (GLOBALFOUNDRIES Inc)
15:30
1057
3-D Extension of Chemical Mechanical Polishing for Nano-Structuring Applications on Alternative Technologies
Z. Ozdemir and G. B. Basim (Ozyegin University)
15:50
1058
Planarization of GaN Using a FeIII-Ligand Based Catalyst in H2O2 Solution to Improve Its Removal Rate
L. Xu Jr. (Tinghua University) and G. Pan Sr. (Tsinghua University)
16:10
Concluding Remarks
See more of: D02: Chemical Mechanical Polishing 14
See more of: Dielectric Science and Materials
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