Pulse and Pulse Reverse Electrolytic Processes 3

Tuesday, 30 May 2017: 14:00-16:20
Marlborough B (Hilton New Orleans Riverside)
Chairs:
Maria Inman and Brian Skinn
14:40
Pulse Plating of Copper from Deep Eutectic Solvents
T. Green, X. Su, and S. Roy (University of Strathclyde)
15:00
Silver Electrodeposition from Room Temperature Ionic Liquid Electrolytes
H. Garich, E. J. Taylor (Faraday Technology, Inc.), D. M. Tench (Tench Technology), J. Davis (University of South Alabama), and T. Peng (Kirtland Air Force Base)
15:20
Pulse, Electrodeposited Fe-Ni-Co Metal and Oxide Layered Nanowires
X. Geng, W. Liang, and E. J. Podlaha (Northeastern University)
15:40
Deposition of Functional, Alloy Based Nanowires Via Pulse Plating Methods
W. E. G. Hansal, G. Sandulache, and S. Hansal (Hirtenberger Engineered Surfaces)
16:00
Break