Thin Film Mechanics

Thursday, 5 October 2017: 14:30-17:20
Chesapeake G (Gaylord National Resort and Convention Center)
Chairs:
Adriana Ispas , Gery R. Stafford and Giovanni Zangari
14:30
996
(Invited) Fundamental Origin for Crack Formation Cr Films Electrodeposited from Cr3+ Solutions
K. Ahmadi, N. Chaudhari (University of Houston), T. D. Hall, E. J. Taylor (Faraday Technology, Inc.), and S. Brankovic (University of Houston)
15:10
997
(Invited) In-Situ Stress Measurements during Cobalt Electrodeposition
G. R. Stafford, V. P. Graciano, and U. Bertocci (National Institute of Standards and Technology)
15:50
Intermission
16:40
999
Atomistic Approach for Modeling the Wafer Curvature for Pseudo-Morphic and Non-Pseudo-Morphic Epitaxial Multilayer Structures
A. Kadir (SMART Low Energy Electronic Systems), S. Somasundaram, K. E. Lee (Singapore-MIT Alliance for Research and Technology), S. J. Chua (National University of Singapore), and E. A. Fitzgerald (SMART Low Energy Electronic Systems)
17:00
1000
Effects of Additives on Copper Layer Stress Electroplated on Polyimide
L. J. Lin and W. P. Dow (National Chung Hsing University)
See more of: E05: Mechanics and Metallurgy of Electrodeposited Thin Films
See more of: Electrochemical/Electroless Deposition
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