Oral Session 2

Tuesday, 3 October 2017: 14:00-18:20
Chesapeake G (Gaylord National Resort and Convention Center)
Chairs:
Richard Alkire and L. T. Romankiw
14:00
Introductory Remarks
14:20
955
Discovery to Product – an Engineer's Perspective
D. T. Mah (Self)
14:40
956
The Study of Complexed Copper(II) Ion and Its Application for Electroless Copper Deposition
H. M. Chang and W. P. Dow (National Chung Hsing University)
15:00
957
Electrodeposition of NiPd Alloy in Alkaline Ni2+ – Pd2+ – Cl– – NH3 – H2O System
K. Mech (AGH University of Science and Technology), J. P. Chopart (Université de Reims Champagne-Ardenne), M. Wrobel (AGH University of Sceince and Technology), P. Zabinski, and K. Szacilowski (AGH University of Science and Technology)
15:20
958
Anodic MnO2 deposition on Titanium Electrode Coated with Thermally Prepared Manganese Oxide
Y. Yoshida, K. Kawaguchi, and M. Morimitsu (Doshisha University)
15:40
959
Impedance-Based Characterization of Raw Materials Used in Electrochemical Manufacturing  
M. E. Orazem (University of Florida) and D. P. Riemer (TDK)
16:00
Break
16:20
960
Electrochemical Atomic Layer Deposition: Self-Terminated Electrodeposition Reactions
T. P. Moffat, Y. Liu, S. H. Ahn, N. L. Ritzert, R. Wang, E. Gillette (NIST), D. Gokcen (National Institute of Standards and Technology), H. Tan (NIST, Gaithersburg, MD, USA), C. M. Hangarter (U.S. Naval Research Laboratory), L. Bendersky (NIST), U. Bertocci (National Institute of Standards and Technology), and H. You (Argonne National Laboratory)
16:40
961
Control of Magnetism with Electrochemical Potential
P. Allongue (CNRS-Ecole polytechnique), F. Maroun (CNRS - Ecole Polytechnique), A. Lamirand (Diamond Light Source), N. Tournerie (ECAM Rennes), N. Di (CNRS-Ecole Polytechnique), and R. L. Novak (Federal University of Santa Catarina (Brazil))
17:00
962
Fabrication and Preparation of Micro-Coaxial Wires: Electrodeposition of Conductive Gold Shields
S. C. Barron, P. Sricharoenchaikit, D. A. Torres, A. Kopa, G. Romano, R. H. Morrison, A. P. Magyar, H. Zhang, and C. L. Gray (Draper Laboratory)
17:20
963
Light Assisted Electrodeposition for Silicon Solar Cell Copper Metallization
Q. Huang (The University of Alabama)
17:40
964
The Effect of Levelers on Plating through Holes of a PCB By Using Reduced Graphene Oxide (rGO) As a Conducting Layer
I. H. Chang and W. P. Dow (National Chung Hsing University)
18:00
Concluding Remarks
See more of: E03: Electrochemical Science and Engineering on the Path from Discovery to Product
See more of: Electrochemical/Electroless Deposition
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