In this study the possibility and conditions to use lower oxidation state metal ions as reducing agents for autocatalytic electroless metal deposition are discussed.

The theoretical background of such kind reactions is presented in the view of thermodynamics.

Kinetic data on electroless silver, copper, palladium and platinum deposition using Co(II)/Co(III) redox systems with different ligands are presented and discussed.

Ti(III)/Ti(IV) redox systems with different ligands were shown also to be suitable reducing agents for reducing of Pt(IV), Pd(II), Ni(II) and Co(II) to metallic state and formation of continuous metal layer on the surface to be plated.

The morphology of metal layers deposited using above-mentioned reducing agents was characterized by means of Field Emission Scanning Electron Microscopy (FESEM). Kinetics of metal deposition rate was investigated by means of the gravimetry or Electrochemical Quartz Crystal Microgravimetry (EQCM).