Surfactant Mediated Nucleation and Growth 6

Wednesday, 16 May 2018: 14:00-17:40
Room 211 (Washington State Convention Center)
Chairs:
Rohan Akolkar , Thomas P. Moffat and Peter Broekmann
14:00
1260
Electrolyte and Electrode Design for Dynamic Windows Based on Reversible Metal Electrodeposition
M. Strand, T. Hernandez, D. Slotcavage (Stanford University), C. J. Barile (University of Nevada, Reno), and M. D. McGehee (Stanford University)
14:20
1261
The Effect of Pulsed Current and Organic Additives on the Hydrogen Incorporation in Electroformed Copper Used in High Vacuum Applications
L. Lain Amador (CERN, European Organization for Nuclear Research), J. Rolet (IRT M2P, 4, rue Augustin Fresnel F-57070 Metz), M. L. Doche (UTINAM UMR 6213 CNRS University Bourgogne Franche-Comté), P. Massuti Ballester (CERN, European Organization for Nuclear Research), M. P. Gigandet, V. Moutarlier (UTINAM UMR 6213 CNRS Univ BOURGOGNE FRANCHE COMTE), M. Taborelli, L. M. A. Ferreira, P. Chiggiato (CERN, European Organization for Nuclear Research), and J. Y. Hihn (UTINAM UMR 6213 CNRS Univ BOURGOGNE FRANCHE COMTE)
14:40
1262
(Invited) Adsorbate and Impurity Effects during Co Deposition and Planarization for MOL Contact and Beol Metallization
J. Kelly (IBM Research), V. Kamineni (GLOBALFOUNDRIES), X. Lin (Globalfoundries), Y. Liang (GLOBALFOUNDRIES), H. Amanapu (IBM), B. Peethala (IBM Albany), M. Raymond (GLOBALFOUNDRIES), and B. Haran (IBM Research)
15:20
1263
Influence of Pulse Current Sequences and Organic Additives on pH Measured By Local Methods
J. Rolet (IRT M2P, 4, rue Augustin Fresnel F-57070 Metz), B. Vuillemin (ICB UMR CNRS 6303 Univ. Bourgogne Franche Comte), M. P. Gigandet (UTINAM UMR 6213 CNRS Univ BOURGOGNE FRANCHE COMTE), C. Gleyzes (UT2A), and J. Y. Hihn (UTINAM UMR 6213 CNRS Univ BOURGOGNE FRANCHE COMTE)
15:40
Break
16:00
1264
CuNi Alloy Electrodeposition for Microbumps Using Benzotriazole
K. P. Haesevoets (Centre for Surface Chemistry and Catalysis, KU Leuven, imec), A. Radisic (imec), and P. M. Vereecken (imec and KU-Leuven, Belgium, Centre for Surface Chemistry and Catalysis, KU Leuven)
16:20
1265
Influence of Applied Potential, Water Content and Forced Convection on the Electrodeposition of Ni Films on Steel from Choline Chloride Based Deep Eutectic Solvents
M. Łukaczyńska (Vrije Universiteit Brussel), K. Van den Bergh, J. De Strycker (OCAS), H. Terryn (Vrije Universiteit Brussel), and J. Ustarroz (Vrije Universiteit Brussel, SURF Group)
16:40
1266
Effects of Microstructure of Nickel Electrodeposits on the Growth of Tin-Nickel Intermetallic Compound and Joint Reliability
M. Park (Thinfilm Technology Team, Samsung Electronics Co. Ltd., Korea Advanced Institute of Science and Technology), T. Ryu, S. Lee, K. Kim (Thinfilm Technology Team, Samsung Electronics Co. Ltd.), and H. Kwon (Korea Advanced Institute of Science and Technology)
17:00
1267
Tailoring the Surface Morphology and Microstructure of Electrodeposited Copper Foil with Organic Additives
C. C. Lin (National Tsing Hua Univesity) and C. C. Hu (National Tsing Hua University)
17:20
1268
Multivalent Metal Ions As Efficient Reducing Agents for Electroless Metal Deposition Processes
E. Norkus and L. Tamasauskaite-Tamasiunaite (Center for Physical Sciences and Technology)
See more of: E02: Surfactant and Additive Effects on Thin Film Deposition, Dissolution, and Particle Growth
See more of: Electrochemical/Electroless Deposition
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