Monday, 14 May 2018: 14:00-16:00
Room 211 (Washington State Convention Center)
Chairs:
Benjamin Wiley
and
Peter Broekmann
15:40
Atomic Layer Deposition Using Self-Terminated Electrodeposition Reactions
T. P. Moffat (NIST), Y. Liu (Lam Research Corporation), S. H. Ahn (National Institute of Standards and Technology), N. L. Ritzert (Theiss Research/NIST), R. Wang (Argonne National Laboratory), E. Gillette (University of Maryland), D. Gokcen (National Institute of Standards and Technology), C. Hangarter (U.S. Naval Research Laboratory), H. Tan (NIST, Gaithersburg, MD, USA), L. Bendersky (NIST), H. You (Argonne National Laboratory), and U. Bertocci (National Institute of Standards and Technology)