Surfactant Mediated Nucleation and Growth 5

Wednesday, 16 May 2018: 08:00-12:00
Room 211 (Washington State Convention Center)
Chairs:
Peter Broekmann , Rohan Akolkar and Thomas P. Moffat
08:00
1251
(Invited) Additives in Cu Plating for Microelectronics Applications
A. Radisic (imec), F. M. Ross (IBM T.J. Watson Research Center), K. P. Haesevoets (imec, Centre for Surface Chemistry and Catalysis, KU Leuven), H. Struyf (imec), and P. M. Vereecken (imec, Belgium, Centre for Surface Chemistry and Catalysis, KU Leuven)
08:40
1252
(Invited) Chain Length Variation to Probe Mechanism of Accelerator Additives in Copper Electrodeposition
A. A. Gewirth (University of Illinois), R. Schmidt (Atotech Deutschland GmbH), K. G. Schmitt, and R. Rooney (University of Illinois at Urbana-Champaign)
09:00
1253
Superconformal Cu Electrodeposition: Seiras and STM Study of the Polyether-SPS-Cl System
G. Liu (NIST), S. Zou (American University), L. Y. Ou Yang, D. Josell, L. Richter, and T. P. Moffat (NIST)
09:20
1254
Copper Electroplating with Polyethylene Glycol and Chloride: Modeling, Experimental Analysis and Parameter Determination
H. Yang (TU Dresden), R. Krause, C. Scheunert, R. Liske, B. Uhlig (Fraunhofer Institute for Photonic Microsystems), A. Preusse (Globalfoundries Dresden Module One LLC & Co.KG), A. Dianat, M. Bobeth, and G. Cuniberti (TU Dresden)
09:40
Break
10:00
1255
Observation of Additive Behavior in Copper Electroplating Using Microfluidic Device
M. Tomie, T. Akita, R. Ikuta, and M. Hayase (Tokyo University of Science)
10:20
1256
Exploiting the Spatial Homogeneity of Adlayer Breakdown on Microelectrodes to Develop a Kinetic Model for S-NDR Copper Electrodeposition
T. M. Braun and T. P. Moffat (NIST)
10:40
1257
Surface Morphology of Copper Pulse Deposition in a Controlled Environment Using Microfluidic Device
R. Kawazoe, A. Yamauchi, and M. Hayase (Tokyo University of Science)
11:00
1258
Electrodeposition of Nickel Nanostructures from Deep Eutectic Solvent / Water Mixtures
E. A. Mernissi Cherigui (Vrije Universiteit Brussel), K. Sentosun (University of Antwerp), S. Bals (EMAT, University of Antwerp), H. Terryn (Vrije Universiteit Brussel), and J. Ustarroz (Vrije Universiteit Brussel, SURF Group)
11:20
1259
Spatial Chemical Analysis of Electrodeposited Metal Films By Femtosecond Laser Ablation Ionization Mass Spectrometry
P. Moreno-García, V. Grimaudo, A. Riedo, A. Cedeño López, R. Wiesendanger, M. Tulej (University of Bern), C. Gruber, E. Lörtscher (IBM Research - Zurich, Science and Technology Department), P. Wurz, and P. Broekmann (University of Bern)
See more of: E02: Surfactant and Additive Effects on Thin Film Deposition, Dissolution, and Particle Growth
See more of: Electrochemical/Electroless Deposition
<< Previous Session | Next Session >>