Proactive Contamination Control: The Only Way to Enable Yield of Advanced Semiconductor Manufacturing

Tuesday, 15 October 2019: 16:20
Room 209 (The Hilton Atlanta)
S. Libman (FTD Solutions LLC)
Advanced Semiconductor Manufacturing has reached the limits of metrology measuring contamination and defects on both the wafers and in the high purity materials (i.e., killer size particles in liquid chemicals and ultrapure water). Furthermore, ability of the most advanced filters to control particles in sub-10nm range is also limited. High purity materials used in liquid delivery systems have never been qualified for sub-10nm size particles. Finally, particle shedding of sub-10nm particles from high-purity components located post-filter cannot be directly measured and only be estimated using power-law extrapolation.

Yield Enhancement IFT (international focus team) of IRDS (International Roadmap for Devices and Systems) is working together with the Liquid Chemical Committee of SEMI Standards to establish the methodology to enable proactive technology management in the space of contamination control.

This presentation will provide the most recent experimental data generated by UPW IRDS team and SEMI Standards Liquid Chemical task forces, demonstrating the issues related to the contamination occurrence. The presentation will also include information about the SEMI standards and corresponding systematic approach that supports supply chain effort for developing and commercialization of new solutions to proactively address the contamination issues.