In this work, we present the elaboration procedure of an all-solid-state synaptic transistor composed of nanoscale electrolyte and channel layers. The devices have been elaborated on 8’’ Silicon wafers using microfabrication processes compatible with conventional semiconductor technology and CMOS back end of line (BEoL) integration. (Figure 1a)
We demonstrate the excellent synaptic plasticity properties of short-term potentiation (STP) and long-term potentiation (LTP) of our SynT. We performed tests to study the correlation between linearity, asymmetry, and the number of analog states. By averaging the amount of injected ions per write operation, we estimated the energy consumed for switching among adjacent states of this device is 22.5 pJ, yielding area-normalized energy of 4 fJ/µm2. In addition, operating in the range of nS, our SynTs meet the critical criteria of low energy consumption for both write and read operations. Endurance was highlighted by cycling in ambient conditions with 100 states of potentiation and depression for over 1000 cycles with only a slight variation of Gmax/Gmin ratio of 6.2 % (Figure 1b, c). Approximately 95 % accuracy in MNIST pattern recognition test on ANN in the crossbar array configuration has been obtained by simulation with SynTs as synaptic elements reassured SynT is a promising candidate for future neuromorphic computing hardware.
To shed light on the properties of intercalation phenomena of Li ions into the TiO2 layer, a further electrochemical study on a cell comprising Ti/TiO2/LiPON/Li corresponding to the SynT gate stack was performed. This understanding will help to elucidate the correlation with conductance modulation characteristics for a synaptic transistor. Multiple tests were carried out, including cyclic voltammetry (CV) with different scan rates, rate capability with Galvanostatic cycling with potential limit (GCPL), and electrochemical impedance spectroscopy (EIS) on different states of charge. A circuit model was introduced to fit the frequency response of the cell, and it explained well the behavior of charging capability at different OCV (Figure 1d).
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