G01 - FEOL Digital Session

Tuesday, 31 May 2022: 15:40-17:10
West Meeting Room 113 (Vancouver Convention Center)
Chairs:
Paul Mertens and Koichiro Saga
15:40
(Digital Presentation) High-Dose Ion-Implanted Photoresist Stripping Technology Employing High Temperature Single-Wafer SPM System
K. Sasahira, S. Nakamura, K. Hamada, S. Jinbo (Fine Mechatronics Division, Shibaura Mechatronics Corp.), and K. Hattori (Center for Low-temperature Plasma Sciences, Nagoya Univ.)
16:00
(Digital Presentation) Two-Step Wet Clean for HKMG TiAl Protection and Polymer-Free
T. Chen, W. Tu, and H. Zhang (Semiconductor Manufacturing International Corporation)
16:20
(Digital Presentation) Efficient Mandrel Cleaning Process for Fin-FET Technology Node
J. Zhang (Semiconductor Manufacturing International Corporation)
16:40
(Digital Presentation) Adsorption Characteristics of SiO2/Si, Nanocomposites of Multiwalled Carbon Nanotubes and Polyamide, Polyvinyl Chloride, Polyethylene, Porous Polystyrene
Y. A. Onanko, D. V. Charnyi, A. P. Onanko, O. P. Dmytrenko, M. P. Kulish, T. M. Pinchuk-Rugal, and P. P. Ilyin (Kyiv national university)
17:00
Concluding Remarks