E02 - Electrochemical & Electroless Deposition of Alloys & Thin Films 2

Monday, 10 October 2022: 14:00-16:00
Room 301 (The Hilton Atlanta)
Chairs:
Massimo Innocenti and Nikolay Dimitrov
14:00
Recent Advances in Electrodeposition of Copper Ultrathin Films on Cobalt Substrate
L. Guo, J. Han, E. Yakobson, W. Shao, K. Whitten, and E. Najjar (Macdermid Enthone Inc)
14:20
New Frontiers in Electrodeposition for More Sustainable Electroplating Processes
W. Giurlani, M. Vizza, S. M. Martinuzzi, A. Comparini, M. Bonechi, M. Verrucchi, A. Caneschi, and M. Innocenti (University of Florence)
14:40
High Purity Pd Nanofilm Deposition Via Cu Incorporation Control in Slrr Process
S. Kim (Hanyang University), J. Seo (Hanyang university), S. Yoon, and B. Yoo (Hanyang University)
15:00
An Investigation of Tin Electroless Deposition
E. J. O'Sullivan, C. T. Camagong, R. Paranjape, M. Hopstaken, and C. Lavoie (IBM Research Division, Thomas J. Watson Research Center)
15:20
Fast and One-Pot Reductive Deposition of Continuous Uio-66 Films
S. Xie (KU Leuven, Department of Materials Engineering), X. Zhang (KU Leuven, Department of Materials Engineering,), and J. Fransaer (KU Leuven, Department of Materials Engineering)
15:40
Electroless Nickel Plating for Ohmic Contacts to Silicon Power Devices
A. Usenko, S. Dhungana, A. N. Caruso (University of Missouri-Kansas City), and S. L. Bellinger (Semiconductor Power Technologies, Inc.)
See more of: E02: Electrochemical and Electroless Deposition of Functional Materials (Theory, Numerical Simulations, and Applications) 2
See more of: Electrochemical/Electroless Deposition
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